Hong Kong, China Mountaineering and Climbing Union Ltd. (HKCMCU) is planning to organize HK Bouldering Championships 2025 & Asian Cup (Boulder) 2025 on March 1-2, 2025 & March 8-9, 2025 at Piazza, Kowloon Park. Hence, HKCMCU is pleased to invite you to submit a tender with details listed out at the attachment.

 

You are required to submit the below:

(1) Technical Tender Bid and Financial Tender Bid in SEPARATE SEALED ENVELOPE

(2) Company portfolio and / or team profile with key personnel to be involved in the project

(3) Timeline program and marketing management plan.

 

Interested parties should submit the Tender for Technical Bid (with item 2-3) and Financial Bid in SEPARATE SEALED ENVELOPE by 12:00 noon 13 September 2024 (Friday) to the following address:

 

Hong Kong, China Mountaineering and Climbing Union Ltd. (HKCMCU)

Room 1013, Olympic House, No. 1 Stadium Path, So Kon Po, Causeway Bay, Hong Kong

 

Timeline for the tender process.

Activity

Time and Date

Venue

Site visit

By appointment – one week in advance

Piazza, Kowloon Park

Pre-Bid Meeting

Afternoon, 28 August 2024 (Wed)

(by appointment – one week in advance)

Meeting Room, Olympic House

Deadline for written inquiries

5 days prior to bid submission

Via email (office@chkmcu.org.hk)

Deadline for Bid submissions

12:00hrs, 13 September 2024 (Fri)

HKCMCU office,

Room 1013, Olympic House

 

Late submission WILL NOT be accepted. In the event of a typhoon signal No. 8 or above or rainstorm black warning is issued on the closing date before the closing time, the tender closing time will be postponed to the same time on the first working day immediately after the signal or warning is lowered.

 

All costs incurred during the preparation and submission of tenders are to be borne by the tenders and will not be reimbursed.

 

Should you have any query, please feel free to contact Mr. Tommy Wong and Mr. Karl MAN at 2504 8429 and 2504 8129 respectively or by email to office@chkmcu.org.hk.

 

Thank you for your kind attention.

Financial Bid 

Technical Bid